Source: Taiwantrade | Updated: 30 September 2011
Due to fiberglass’s material cost advantage over metals, fresh competition seems inevitable among big names in the industry including Waffer Technology Corp., Catcher Technology Co., LTD., Foxconn Technology Co., Ltd., Taiwan Chi Cheng Enterprise Co., Ltd., and Ju Teng International Holdings Limited.
Acer indicated that its lineup of Ultrabooks should still use metallic casing for better heat dissipation. Nevertheless, the company recognized potential design opportunities offered by fiberglass.
Major brands such as HP, Dell demonstrated particularly high hopes for Ultrabooks. The brands have become less dependent on ODM factories by collaborating with case makers from the initial product design stage, and closely monitor ODM factories every step of the way during the manufacturing stage.